[Text|High-tech LED reporter Zhou Kaibo] High-profile LED industry event--2014 Gaogong LED Lighting Exhibition will be held in Guangzhou Pazhou Canton Fair Complex on September 26-28, Shenzhen Getian Optoelectronics Co., Ltd. (hereinafter referred to as "Gertian Optoelectronics") will exhibit high-density flip-chip LED modules and other products at the exhibition.
Shenzhen Getian Optoelectronics Co., Ltd. was founded in 2005 to locate the high-power lighting-level LED packaging market. In 2012, it introduced flip-chip packaging technology and equipment. In 2013, Getian’s world's first flip-chip LED module was sold to the market. And won the praise of customers, in 2014, Getian launched the first series of high-end lighting for all stage lights to launch the 300W flip chip series.
"Compared to the positive and vertical chip packaging methods, the flip-chip LED integrated light source eliminates the need to strike the gold wire, which can effectively avoid various risks caused by the gold wire, such as reducing the probability of dead lights by more than 90%, ensuring the product. The stability, and secondly, the technology's heat dissipation capability is better than the traditional package." Hu Shuangguang, director of the market, said to the "High-tech LED" reporter.
Zhang Hongbiao, research director of the High-tech LED Industry Research Institute, predicts that in the next 2-3 years, flip-chip packaging products will account for 20%-30% of the total package output.
As the first company to get involved in flip chip technology in China, Getian Optoelectronic's flip-chip LED integrated light source has been involved in many subdivisions such as projectors, stage lighting, medical equipment, automotive main lighting, long-distance projection and other special lighting.
Hu Shuangneng said that Getian Optoelectronic's flip chip module products have the following advantages: high power, small light-emitting area can effectively distribute light, realize small-area long-distance light distribution; ceramic substrate design of high thermal conductivity aluminum nitride using thermoelectric separation The thermal resistance is as low as 0.03 °C / W, the withstand voltage test exceeds 3000V; the temperature control feedback system is provided, and the heat dissipation temperature is more precise.
Shenzhen Getian Optoelectronics Co., Ltd. was founded in 2005 to locate the high-power lighting-level LED packaging market. In 2012, it introduced flip-chip packaging technology and equipment. In 2013, Getian’s world's first flip-chip LED module was sold to the market. And won the praise of customers, in 2014, Getian launched the first series of high-end lighting for all stage lights to launch the 300W flip chip series.
"Compared to the positive and vertical chip packaging methods, the flip-chip LED integrated light source eliminates the need to strike the gold wire, which can effectively avoid various risks caused by the gold wire, such as reducing the probability of dead lights by more than 90%, ensuring the product. The stability, and secondly, the technology's heat dissipation capability is better than the traditional package." Hu Shuangguang, director of the market, said to the "High-tech LED" reporter.
Zhang Hongbiao, research director of the High-tech LED Industry Research Institute, predicts that in the next 2-3 years, flip-chip packaging products will account for 20%-30% of the total package output.
As the first company to get involved in flip chip technology in China, Getian Optoelectronic's flip-chip LED integrated light source has been involved in many subdivisions such as projectors, stage lighting, medical equipment, automotive main lighting, long-distance projection and other special lighting.
Hu Shuangneng said that Getian Optoelectronic's flip chip module products have the following advantages: high power, small light-emitting area can effectively distribute light, realize small-area long-distance light distribution; ceramic substrate design of high thermal conductivity aluminum nitride using thermoelectric separation The thermal resistance is as low as 0.03 °C / W, the withstand voltage test exceeds 3000V; the temperature control feedback system is provided, and the heat dissipation temperature is more precise.
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