OSRAM silicon wafer substrate LED chip come out

OSRAM (Germany) has successfully placed a layer of GaN luminescent material on a silicon wafer substrate with a diameter of 150 mm to produce a high-performance blue-white light-emitting diode (LED) prototype silicon chip. This is the first time in the world that a silicon wafer substrate has been used to replace a sapphire substrate to make an LED chip and maintain the same lighting quality and efficiency. After testing, the Blu-ray UX:3 chip has a power of 634 milliwatts at a voltage of 3.15 volts, which is equivalent to a conversion efficiency of 58%. It is reported that this LED chip has entered the pilot phase and is expected to launch the market within two years.

Silicon is widely used in the semiconductor industry, can meet the large wafer diameter production requirements, and has better thermal properties and lower prices, so the silicon wafer substrate chip has obvious advantages.