February 8, 2005... IRVINE, California USA--Microsemi Corp. (Nasdaq:MSCC - news), will introduce its new UPBLED470A UltraBright blue light-emitting diodes today at the Strategies and Light Conference being held in Burlingame, Calif., While revealing its systems engineering strategy for next-generation LED products, including light engine architectures and a breakthrough LED on silicon technology.
Microsemis new blue UltraBright LEDs combine a derivative of the companys patented Powermite? packaging, called Optomite? and gallium nitride (GaN)-based die from Cree, a combination that allows higher power in a smaller surface mount package.
The new UltraBright product joins Microsemis first LED, the blue MegaBright UPBLED470B that also is based on GaN die from Cree. As described at the conference, these two conventional LEDs are the first in what will become a line of high-power, high-brightness Blue and white LEDs from Microsemi.
``While our patented power packaging technology is chip agnostic, Microsemi will use the technology that best fits the advantages of our Optomite package, commented Manuel Lynch, vice president of business development.
Microsemi respective defined LED driver product line solutions as including parallel and series drivers, inductor-based boost, charge pump voltage doublers and current sink regulators, as well as a future intelligent driver that will provide constant brightness and power, and enable wide temperature operation To offset heat and over current-generated electro-migration effects that cause failures in the form of reduced light output in high-brightness nitride-based LEDs.
The company estimates it has more than 50% design win penetration for LED drivers in next-generation PDAs.
Conference attendees also viewed a breakthrough proof-of-concept silicon-based GaN die prototype using Microsemis chip-scale MMSM? technology that promises to yield white LEDs in ultraviolet-resistant glass packages having no wire bonds, called LightChips?.
Microsemi said its breakthrough prototype results were successful. The company has commenced the next stage of development to make a white LED LightChip. The company expects to sample white LED chips by this summer with production starting as early as the end of the calendar year.
The LightChip technology is based on the merging of the SIGANTIC? gallium nitride on large area silicon wafer technology developed by Nitronex Corp., of Raleigh, NC and Microsemis patented wafer scale MMSM chip technology.
Microsemi emphasized at the conference that the two companies plan to use their developmental alliance as a platform to commercialize their technologies broadly with other LED chip, packaging, reflector cup, phosphor and light guide partners in the lighting industry --including those attending and presenting at The Strategies and Light Conference.
``The intent of LightChip is to open a new chapter in LED technologies. Our architecture will accelerate the merge of chip, package, phosphors and reflector cup at the wafer level and provide a clear application conscious roadmap that paves the way for using LEDs as Viable alternatives for incandescent and fluorescent technologies, stated Lynch.
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About Microsemi
Microsemi is a leading designer, manufacturer and marketer of analog, mixed-signal and discrete semiconductors. The companys semiconductors manage and regulate power, protect against transient
Voltage spikes and transmit, receive and amplify signals.
Microsemi products include individual components, as well as complete circuit solutions that enhance customer designs by providing battery optimization, reducing size or protecting circuits. Markets
The company serves include mobile connectivity, computer/peripherals, telecommunications, medical, industrial/commercial, space/satellite and military.
More information may be obtained by contacting the company directly or by visiting its Web site at http://
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Tel: (949) 221-7101
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