Solid crystal machine is widely used in LED production industry, is a high precision and high efficiency production equipment, its accuracy is to send crystal Tabel, crystal arm and silver slurry system using a fully digitally controlled servo system and Intelligent image recognition technology.
The LED die bonding process is a kind of operation mode for Pick and Place, that is, the LED chip is removed from the wafer by the suction nozzle, and then placed in the LED support cup or on the PCB substrate. In order to fix the wafer, a dispensing process was added thereto.
The introduction of machine vision can accurately locate the position of the picking wafer and the location of the wafer to be dispensed and dispensed. The motion control moves the wafer directly under the suction nozzle based on the visual position feedback information.
In this solution, two camera systems and two XY platform motion control systems are used. One camera and motion system completes the positioning of the stand or PCB, and the other sets the position of the LED chip.
Based on the needs of equipment development customers, our company provides the most cost-effective machine vision and motion control solutions on the market today. For more inquiries, call Positive and Negative Technologies.